Intel reported Q2 2026 revenue of $16.128 billion, a 25.4% increase year-over-year. The company also reported a GAAP net loss of $11.033 billion, driven by a $12.53 billion non-cash charge related to the CHIPS Act escrow.
In contrast, TSMC reported Q2 2026 revenue of $40.20 billion, a 36.0% increase year-over-year, with an EPS of $4.31 and a gross margin of 67.7%. Intel’s CEO Lip-Bu Tan commented, “AI is driving unprecedented demand for compute.”
Intel's market capitalization, versus TSMC's $2.07 trillion.
Intel guided Q3 revenue to between $15.80 billion and $16.80 billion, with a non-GAAP gross margin of approximately 42.0%. TSMC guided Q3 revenue to between $44.6 billion and $45.8 billion, with a gross margin between 65% and 67%.
Intel aims to offer up to 50% cost advantages compared to TSMC's CoWoS solution with its new EMIB-T packaging technology, which is expected to enter mass production next year. TSMC holds more than 80% to 85% of the market share in 2.5D and 3D advanced packaging technologies used by companies like Nvidia, AMD, Apple, and Amazon.
TSMC is reportedly facing technical challenges, specifically a warping issue, with the CoWoS-L packaging design for Nvidia's 'Vera Rubin' architecture.
